US plans research support for power chips serving AI and fusion
The US Commerce Department signed four letters of intent for power-semiconductor and materials research support totaling up to 389 million dollars. The proposed projects cover AI data-centre power conversion, fusion electronics and high-purity quartz. Final approval remains pending. The government intends to take minority stakes without control or voting rights as a condition of the awards.
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Four research proposals await final approval
The US Commerce Department signed letters of intent with four companies for research into power semiconductors and critical materials. The proposed support under the CHIPS and Science Act totals up to 389 million dollars. The projects cover electricity conversion, control and delivery for AI data centres, grid infrastructure and fusion systems. All four proposals remain subject to final approval.[1], [2]
Vertical targets power conversion inside AI racks
Vertical Semiconductor, a power-chip developer, is proposed to receive up to 73 million dollars for vertical gallium nitride devices. The company aims to improve conversion efficiency and shrink power-supply systems for advanced computing equipment. It plans a demonstration in a 2.5 MW-class AI data-centre rack. The Commerce Department’s stated objectives include reducing thermal losses and dependence on overseas supply chains while strengthening domestic research and manufacturing.[1]
Fusion electronics and quartz share the programme
Fusion developer Helion’s proposed ceiling is 175 million dollars for high-voltage power semiconductors and modules serving fusion-system magnets. Commonwealth Fusion Systems, another fusion company, has a proposed ceiling of 85 million dollars for plasma-heating, diagnostic and radiation-resistant electronics. Materials supplier Sibelco is proposed to receive up to 56 million dollars for ultra-high-purity quartz purification and finishing. The government intends to receive minority equity without control or voting rights in each recipient as a condition of support.[1]