A first-quarter 2027 training chip
TechCrunch reports that Huawei is moving the next-generation Ascend 960DT to the first quarter of 2027, after David Wang announced the timeline at Huawei Connect on Thursday. A spokesperson told the site the company had previously planned a third-quarter 2027 launch and said the 960 series is launching ahead of schedule with claimed doubling of performance. A Huawei spokesperson told TechCrunch at Huawei Connect that the next-generation Ascend 960DT AI chip is expected in the first quarter of 2027 instead of the third; that is an announced timetable; public shipment has not been shown. The spokesperson said rotating and acting chairman David Wang announced the updated timetable on Thursday. Huawei describes a Peerium Computing Architecture that uses UnifiedBus to link processors with memory, storage and networking; Atlas 950 SuperPoD and SuperCluster are the first systems on that architecture. The company says an Atlas 950 SuperCluster can connect up to 256,000 accelerator cards. Analyst Rui Ma wrote on X that an earlier Atlas 960 SuperPoD scale does not match this week’s description of a system with 4,096 chips. The Straits Times, writing from the same Shanghai summit, also puts the flagship 960DT in the first quarter of 2027.[1], [2]
