ASML said Samsung would deploy its High NA extreme ultraviolet machines by 2028 and TSMC from 2030. Both follow Intel, which has already run more than 1 million wafers through the tools on its 18A process. The companies also opened a shift from today's 6 inch photomask to a 12 inch one, with testing in 2031 and production in 2033.
Samsung has expanded its partnership with ASML to use High NA EUV machines for more advanced logic and memory chips in the AI era. ASML presented the step as Samsung's commitment to those High NA extreme ultraviolet tools. The partnership puts the Dutch equipment maker's newest lithography generation onto Samsung's manufacturing line.[1], [3]
ASML said Samsung would deploy its High NA extreme ultraviolet machines by 2028 and TSMC from 2030. TSMC said it will begin using ASML's most advanced chipmaking tool from 2030. Samsung is targeting adoption as early as 2028. Intel said it is already mass producing with the new machine.[1], [2]
The three companies also opened an initiative to move from today's 6 inch photomask to a 12 inch one, which removes the stitching step that large chip patterns now need. Testing begins in 2031 and production in 2033, and SK Hynix is weighing whether to join. Intel has already run more than 1 million wafers through the tools on its 18A process. ASML's chief technology officer said that if the industry carries it through, the productivity of those systems will go up by 40 percent.[1]
